Scholarly Index
Rajan Ambat
Technical University of Denmark; 5,319 total citations; 293 total publications; best world rank #56
Technical University of Denmark
5,319Total citations
293Total publications
35H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 210 | DK 1 | 97.73 |
| Corrosion Behavior and Inhibition | Lifetime | 524 | DK 3 | 97.36 |
| Electrostatic Discharge in Electronics | Lifetime | 270 | DK 3 | 96.17 |
| Anodic Oxide Films and Nanostructures | Lifetime | 251 | DK 1 | 95.23 |
| Aluminum Alloy Microstructure Properties | Lifetime | 916 | DK 6 | 96.58 |
| Electrostatic Discharge in Electronics | 2021-2025 | 56 | DK 2 | 93.10 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 180 | DK 1 | 91.77 |
| Corrosion Behavior and Inhibition | 2021-2025 | 811 | DK 5 | 89.84 |
| Hydrogen embrittlement and corrosion behaviors in metals | 2021-2025 | 820 | DK 2 | 86.58 |
| 3D IC and TSV technologies | 2021-2025 | 729 | DK 2 | 74.99 |
| Material Properties and Processing | 2021-2025 | 233 | DK 2 | 65.86 |