Scholarly Index
Wen‐Sheng Zhao
Hangzhou Dianzi University; 3,635 total citations; 302 total publications; best world rank #2
Hangzhou Dianzi University
3,635Total citations
302Total publications
31H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 207 | CN 54 | 97.74 |
| Microwave and Dielectric Measurement Techniques | Lifetime | 85 | CN 7 | 97.75 |
| Microwave Engineering and Waveguides | Lifetime | 783 | CN 233 | 97.44 |
| Electromagnetic Compatibility and Noise Suppression | Lifetime | 493 | CN 90 | 96.60 |
| Electronic Packaging and Soldering Technologies | Lifetime | 617 | CN 167 | 95.10 |
| Low-power high-performance VLSI design | Lifetime | 701 | CN 67 | 95.37 |
| Microwave and Dielectric Measurement Techniques | 2021-2025 | 2 | CN 1 | 99.22 |
| Microwave Engineering and Waveguides | 2021-2025 | 67 | CN 41 | 98.88 |
| Acoustic Wave Resonator Technologies | 2021-2025 | 44 | CN 31 | 97.70 |
| Advanced Fiber Optic Sensors | 2021-2025 | 566 | CN 397 | 92.86 |
| 3D IC and TSV technologies | 2021-2025 | 246 | CN 114 | 88.93 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 286 | CN 142 | 87.78 |
| Electromagnetic Compatibility and Noise Suppression | 2021-2025 | 451 | CN 179 | 80.22 |
| Copper Interconnects and Reliability | 2021-2025 | 394 | CN 100 | 66.00 |
| RFID technology advancements | 2021-2025 | 432 | CN 126 | 62.93 |