Top1000 Scholar

Scholarly Index

Jieshi Chen

Shanghai University of Engineering Science; 2,290 total citations; 109 total publications; best world rank #79

Shanghai University of Engineering Science

2,290Total citations
109Total publications
29H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime495CN 13895.81
3D IC and TSV technologiesLifetime660CN 16294.87
Electronic Packaging and Soldering Technologies2021-202579CN 4395.58
3D IC and TSV technologies2021-202585CN 3694.80
Intermetallics and Advanced Alloy Properties2021-2025192CN 15193.34
Semiconductor materials and interfaces2021-2025163CN 3892.30
Welding Techniques and Residual Stresses2021-2025831CN 39688.73
High Temperature Alloys and Creep2021-2025542CN 38484.06
Advanced Welding Techniques Analysis2021-2025909CN 41782.98