Scholarly Index

Hsien‐Chie Cheng

Feng Chia University; 2,090 total citations; 146 total publications; best world rank #231

Feng Chia University

2,090Total citations
146Total publications
27H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime231TW 2297.59
Electronic Packaging and Soldering TechnologiesLifetime244TW 2697.48
Electronic Packaging and Soldering Technologies2021-2025321TW 2686.95
3D IC and TSV technologies2021-2025531TW 5480.10
Electromagnetic Compatibility and Noise Suppression2021-2025673TW 974.29