Scholarly Index
Hsien‐Chie Cheng
Feng Chia University; 2,090 total citations; 146 total publications; best world rank #231
Feng Chia University
2,090Total citations
146Total publications
27H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 231 | TW 22 | 97.59 |
| Electronic Packaging and Soldering Technologies | Lifetime | 244 | TW 26 | 97.48 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 321 | TW 26 | 86.95 |
| 3D IC and TSV technologies | 2021-2025 | 531 | TW 54 | 80.10 |
| Electromagnetic Compatibility and Noise Suppression | 2021-2025 | 673 | TW 9 | 74.29 |