Scholarly Index
Xiaojing Wang
Jiangsu University of Science and Technology; 5,840 total citations; 319 total publications; best world rank #36
Jiangsu University of Science and Technology
5,840Total citations
319Total publications
40H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 307 | CN 89 | 96.96 |
| 3D IC and TSV technologies | Lifetime | 735 | CN 180 | 94.42 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 36 | CN 19 | 97.12 |
| 3D IC and TSV technologies | 2021-2025 | 145 | CN 68 | 92.93 |
| Copper Interconnects and Reliability | 2021-2025 | 741 | CN 218 | 51.44 |