Top1000 Scholar

Scholarly Index

Jenn‐Ming Song

National Chung Hsing University; 2,763 total citations; 215 total publications; best world rank #153

National Chung Hsing University

2,763Total citations
215Total publications
29H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime153TW 1598.12
3D IC and TSV technologiesLifetime256TW 2497.42
Intermetallics and Advanced Alloy PropertiesLifetime806TW 1996.08
Advanced Welding Techniques AnalysisLifetime671TW 1595.14
Nanomaterials and Printing TechnologiesLifetime736TW 1189.39
3D IC and TSV technologies2021-2025325TW 3486.21
Electronic Packaging and Soldering Technologies2021-2025410TW 3484.87
Nanomaterials and Printing Technologies2021-2025781TW 864.67