Scholarly Index
Sinn-wen Chen
National Tsing Hua University; 5,554 total citations; 252 total publications; best world rank #67
National Tsing Hua University
5,554Total citations
252Total publications
40H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 67 | TW 7 | 98.88 |
| 3D IC and TSV technologies | Lifetime | 87 | TW 8 | 98.79 |
| Metallurgical and Alloy Processes | Lifetime | 78 | TW 2 | 97.82 |
| Intermetallics and Advanced Alloy Properties | Lifetime | 259 | TW 5 | 98.28 |
| Aluminum Alloy Microstructure Properties | Lifetime | 490 | TW 4 | 97.91 |
| Semiconductor materials and interfaces | Lifetime | 736 | TW 16 | 97.31 |
| Advanced Thermoelectric Materials and Devices | Lifetime | 391 | TW 3 | 96.55 |
| Copper Interconnects and Reliability | Lifetime | 402 | TW 26 | 96.25 |
| Advanced Welding Techniques Analysis | Lifetime | 562 | TW 12 | 95.84 |
| Phase-change materials and chalcogenides | Lifetime | 973 | TW 5 | 92.27 |
| Thermal properties of materials | Lifetime | 966 | TW 10 | 91.94 |
| Solidification and crystal growth phenomena | Lifetime | 601 | TW 5 | 92.76 |
| Phase-change materials and chalcogenides | 2021-2025 | 407 | TW 2 | 80.89 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 886 | TW 82 | 72.84 |
| Metallurgical and Alloy Processes | 2021-2025 | 145 | TW 4 | 68.75 |