Top1000 Scholar

Scholarly Index

Yingxia Liu

City University of Hong Kong; 2,194 total citations; 128 total publications; best world rank #32

City University of Hong Kong

2,194Total citations
128Total publications
23H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime305CN 7797.07
Electronic Packaging and Soldering TechnologiesLifetime324CN 9596.88
3D IC and TSV technologies2021-202532CN 1497.29
Electronic Packaging and Soldering Technologies2021-202534CN 1897.34
Copper Interconnects and Reliability2021-202535CN 992.75
Nanomaterials and Printing Technologies2021-2025232CN 9782.98
Material Properties and Processing2021-2025735CN 14028.97