Scholarly Index

Kim S. Siow

National University of Malaysia; 3,881 total citations; 98 total publications; best world rank #116

National University of Malaysia

3,881Total citations
98Total publications
25H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime274MY 297.23
3D IC and TSV technologiesLifetime349MY 196.76
Electronic Packaging and Soldering Technologies2021-2025116MY 294.11
Plasma Applications and Diagnostics2021-2025728MY 278.87
3D IC and TSV technologies2021-2025779MY 1473.67
Powder Metallurgy Techniques and Materials2021-2025182MY 167.75