Scholarly Index
Yunwen Wu
Shanghai Jiao Tong University; 2,046 total citations; 127 total publications; best world rank #9
Shanghai Jiao Tong University
2,046Total citations
127Total publications
22H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Copper Interconnects and Reliability | 2021-2025 | 9 | CN 2 | 96.93 |
| Electrodeposition and Electroless Coatings | 2021-2025 | 46 | CN 27 | 93.89 |
| 3D IC and TSV technologies | 2021-2025 | 249 | CN 116 | 88.84 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 381 | CN 185 | 85.61 |
| Nanoporous metals and alloys | 2021-2025 | 185 | CN 104 | 67.35 |