Scholarly Index
Fupeng Huo
Osaka University; 294 total citations; 35 total publications; best world rank #94
Osaka University
294Total citations
35Total publications
11H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | 2021-2025 | 94 | JP 6 | 95.19 |
| 3D IC and TSV technologies | 2021-2025 | 299 | JP 15 | 86.98 |
| Copper Interconnects and Reliability | 2021-2025 | 329 | JP 12 | 69.35 |