Scholarly Index
Feng Li
University of Idaho; 374 total citations; 48 total publications; best world rank #152
University of Idaho
374Total citations
48Total publications
10H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | 2021-2025 | 152 | US 24 | 92.60 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 260 | US 19 | 88.90 |