Top1000 Scholar

Scholarly Index

Ruyu Tian

Harbin Institute of Technology; 729 total citations; 38 total publications; best world rank #138

Harbin Institute of Technology

729Total citations
38Total publications
14H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime904CN 23893.70
3D IC and TSV technologiesLifetime954CN 22293.24
Electronic Packaging and Soldering Technologies2021-2025138CN 8193.34
3D IC and TSV technologies2021-2025190CN 9291.21
Intermetallics and Advanced Alloy Properties2021-2025816CN 57182.29
Copper Interconnects and Reliability2021-2025789CN 23049.90