Top1000 Scholar

Scholarly Index

John H. Lau

Micron Corporation (United States); 10,853 total citations; 491 total publications; best world rank #19

Micron Corporation (United States)

10,853Total citations
491Total publications
50H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime29US 999.30
3D IC and TSV technologiesLifetime31US 1399.41
Engineering Applied ResearchLifetime97US 1398.22
Additive Manufacturing and 3D Printing TechnologiesLifetime194US 4898.86
Copper Interconnects and ReliabilityLifetime142US 6798.13
Nanofabrication and Lithography TechniquesLifetime145US 5897.91
Integrated Circuits and Semiconductor Failure AnalysisLifetime496US 20497.61
Electromagnetic Compatibility and Noise SuppressionLifetime234US 8198.13
Metal Forming Simulation TechniquesLifetime356US 7797.48
Advanced Welding Techniques AnalysisLifetime579US 6995.69
Material Properties and ProcessingLifetime438US 10592.69
VLSI and Analog Circuit TestingLifetime800US 33093.63
Engineering and Materials Science StudiesLifetime219US 2389.58
Structural Analysis of Composite MaterialsLifetime902US 20487.80
3D IC and TSV technologies2021-202519US 498.03
Electronic Packaging and Soldering Technologies2021-202529US 297.56
Nanofabrication and Lithography Techniques2021-202530US 493.32
Integrated Circuits and Semiconductor Failure Analysis2021-2025540US 15483.98