Top1000 Scholar

Scholarly Index

Bongtae Han

University of Maryland, College Park; 4,470 total citations; 229 total publications; best world rank #171

University of Maryland, College Park

4,470Total citations
229Total publications
32H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime171US 3997.96
3D IC and TSV technologiesLifetime194US 6397.83
Advanced Measurement and Metrology TechniquesLifetime201US 3897.49
Optical measurement and interference techniquesLifetime276US 6997.41
Advanced MEMS and NEMS TechnologiesLifetime511US 19396.23
Electrostatic Discharge in ElectronicsLifetime366US 11095.26
Adhesion, Friction, and Surface InteractionsLifetime935US 25993.98
Epoxy Resin Curing ProcessesLifetime979US 16591.37
Material Properties and ProcessingLifetime935US 22486.98
Electronic Packaging and Soldering Technologies2021-2025459US 4183.53
Epoxy Resin Curing Processes2021-2025425US 1980.24
3D IC and TSV technologies2021-2025752US 11874.50