Scholarly Index

Seungbae Park

Binghamton University; 3,500 total citations; 185 total publications; best world rank #37

Binghamton University

3,500Total citations
185Total publications
29H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime187US 6297.89
Electronic Packaging and Soldering TechnologiesLifetime208US 4497.73
Material Properties and ProcessingLifetime376US 9393.30
3D IC and TSV technologies2021-202537US 696.86
Electronic Packaging and Soldering Technologies2021-202563US 696.24