Scholarly Index
Paul Andry
IBM (United States); 3,511 total citations; 69 total publications; best world rank #278
IBM (United States)
3,511Total citations
69Total publications
28H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 278 | US 80 | 97.28 |
| Electronic Packaging and Soldering Technologies | Lifetime | 737 | US 157 | 94.53 |
| Electrical and Thermal Properties of Materials | Lifetime | 772 | US 82 | 73.07 |