Scholarly Index
Andy Fan
Boston University; 2,210 total citations; 47 total publications; best world rank #391
Boston University
2,210Total citations
47Total publications
25H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 391 | US 111 | 96.43 |
| Electronic Packaging and Soldering Technologies | Lifetime | 628 | US 132 | 95.05 |
| Copper Interconnects and Reliability | Lifetime | 899 | US 303 | 93.59 |