Top1000 Scholar

Scholarly Index

Kwang‐Lung Lin

National Cheng Kung University; 4,320 total citations; 247 total publications; best world rank #72

National Cheng Kung University

4,320Total citations
247Total publications
35H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime73TW 798.92
Electronic Packaging and Soldering TechnologiesLifetime80TW 898.79
Copper Interconnects and ReliabilityLifetime199TW 1297.62
Electrodeposition and Electroless CoatingsLifetime126TW 597.25
Semiconductor materials and interfacesLifetime676TW 1397.47
Advanced Welding Techniques AnalysisLifetime267TW 597.49
Intermetallics and Advanced Alloy PropertiesLifetime409TW 797.72
Metallurgical and Alloy ProcessesLifetime194TW 496.15
Aluminum Alloy Microstructure PropertiesLifetime941TW 796.49
Electromagnetic Effects on MaterialsLifetime72TW 294.39
Nanoporous metals and alloysLifetime849TW 1277.25
Copper Interconnects and Reliability2021-2025137TW 2782.26
3D IC and TSV technologies2021-2025985TW 9468.42
Electromagnetic Effects on Materials2021-2025267TW 551.92