Scholarly Index
Young‐Chang Joo
Seoul National University; 7,603 total citations; 277 total publications; best world rank #64
Seoul National University
7,603Total citations
277Total publications
46H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Copper Interconnects and Reliability | Lifetime | 66 | KR 2 | 98.85 |
| Electronic Packaging and Soldering Technologies | Lifetime | 64 | KR 4 | 98.91 |
| 3D IC and TSV technologies | Lifetime | 212 | KR 14 | 97.70 |
| Phase-change materials and chalcogenides | Lifetime | 893 | KR 19 | 92.74 |
| Copper Interconnects and Reliability | 2021-2025 | 118 | KR 7 | 84.21 |
| 3D IC and TSV technologies | 2021-2025 | 586 | KR 52 | 78.67 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 832 | KR 39 | 73.98 |