Scholarly Index

Young‐Chang Joo

Seoul National University; 7,603 total citations; 277 total publications; best world rank #64

Seoul National University

7,603Total citations
277Total publications
46H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Copper Interconnects and ReliabilityLifetime66KR 298.85
Electronic Packaging and Soldering TechnologiesLifetime64KR 498.91
3D IC and TSV technologiesLifetime212KR 1497.70
Phase-change materials and chalcogenidesLifetime893KR 1992.74
Copper Interconnects and Reliability2021-2025118KR 784.21
3D IC and TSV technologies2021-2025586KR 5278.67
Electronic Packaging and Soldering Technologies2021-2025832KR 3973.98