Scholarly Index
Fei‐Yi Hung
National Cheng Kung University; 3,001 total citations; 258 total publications; best world rank #187
National Cheng Kung University
3,001Total citations
258Total publications
25H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 431 | TW 43 | 96.20 |
| 3D IC and TSV technologies | Lifetime | 747 | TW 54 | 94.36 |
| Erosion and Abrasive Machining | Lifetime | 936 | TW 4 | 79.72 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 261 | TW 22 | 88.72 |
| Aluminum Alloy Microstructure Properties | 2021-2025 | 762 | TW 4 | 89.71 |
| Copper Interconnects and Reliability | 2021-2025 | 187 | TW 29 | 77.88 |
| 3D IC and TSV technologies | 2021-2025 | 790 | TW 78 | 73.30 |