Scholarly Index

Fa Xing

Micron (Singapore); 3,455 total citations; 165 total publications; best world rank #125

Micron (Singapore)

3,455Total citations
165Total publications
30H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
3D IC and TSV technologiesLifetime125SG 398.41
Electronic Packaging and Soldering TechnologiesLifetime136SG 898.24
Advanced Welding Techniques AnalysisLifetime415SG 496.66
Material Properties and ProcessingLifetime676SG 689.73
Electronic Packaging and Soldering Technologies2021-2025419SG 684.74
3D IC and TSV technologies2021-2025804SG 1872.86
Material Properties and Processing2021-2025449SG 147.56