Scholarly Index
Fa Xing
Micron (Singapore); 3,455 total citations; 165 total publications; best world rank #125
Micron (Singapore)
3,455Total citations
165Total publications
30H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| 3D IC and TSV technologies | Lifetime | 125 | SG 3 | 98.41 |
| Electronic Packaging and Soldering Technologies | Lifetime | 136 | SG 8 | 98.24 |
| Advanced Welding Techniques Analysis | Lifetime | 415 | SG 4 | 96.66 |
| Material Properties and Processing | Lifetime | 676 | SG 6 | 89.73 |
| Electronic Packaging and Soldering Technologies | 2021-2025 | 419 | SG 6 | 84.74 |
| 3D IC and TSV technologies | 2021-2025 | 804 | SG 18 | 72.86 |
| Material Properties and Processing | 2021-2025 | 449 | SG 1 | 47.56 |