Top1000 Scholar

Scholarly Index

Shih‐kang Lin

National Cheng Kung University; 2,765 total citations; 151 total publications; best world rank #213

National Cheng Kung University

2,765Total citations
151Total publications
29H-index

Published ranking records

FieldWindowWorld rankNational rankImpact score
Electronic Packaging and Soldering TechnologiesLifetime213TW 2297.70
3D IC and TSV technologiesLifetime293TW 2797.17
Copper Interconnects and ReliabilityLifetime765TW 4894.17
Electronic Packaging and Soldering Technologies2021-2025334TW 2886.67
3D IC and TSV technologies2021-2025733TW 7474.89