Scholarly Index
Wei‐Ping Dow
Texas A&M University; 3,758 total citations; 149 total publications; best world rank #85
Texas A&M University
3,758Total citations
149Total publications
34H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Electronic Packaging and Soldering Technologies | Lifetime | 144 | US 34 | 98.18 |
| Electrodeposition and Electroless Coatings | Lifetime | 85 | US 15 | 97.83 |
| Copper Interconnects and Reliability | Lifetime | 270 | US 112 | 97.15 |