Scholarly Index
Kenneth P. Rodbell
IBM (United States); 3,675 total citations; 129 total publications; best world rank #222
IBM (United States)
3,675Total citations
129Total publications
30H-index
Published ranking records
| Field | Window | World rank | National rank | Impact score |
|---|---|---|---|---|
| Copper Interconnects and Reliability | Lifetime | 246 | US 103 | 97.31 |
| Radiation Effects in Electronics | Lifetime | 222 | US 126 | 96.88 |
| Electronic Packaging and Soldering Technologies | Lifetime | 579 | US 119 | 95.31 |